General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management




Скачать 245.75 Kb.
НазваниеGeneral Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management
страница1/8
Дата08.10.2012
Размер245.75 Kb.
ТипДокументы
  1   2   3   4   5   6   7   8


Top of Form

Bottom of Form

Organizing Committee

General Chair


Yogendra K. Joshi Georgia Institute of Technology, USA

Program Chair

Sandeep Tonapi

Anveshak Technology and Knowledge Solutions, USA
Chair, Thermal Management

Mehdi Asheghi Stanford University, USA

Co-Chairs, Thermal Management

Gamal Refai-Ahmed AMD, Canada


Madhusudan Iyengar IBM, USA

Chair, Mechanics


John Hock Lye Pang

Nanyang Technological University, Singapore

Co-Chair, Mechanics


Jie-Hua “Jeff” Zhao Texas Instruments, USA

Qiang Yu .....Yokohama National University

Chair, Emerging Technologies


Suresh Garimella Purdue University, USA

Co-Chair, Emerging Technologies


Arun Gowda GE Global Research, USA

Chair, Panel Discussions

Victor Chiriac Freescale Semiconductor, USA

Co-Chair, Panel Discussions


Pradeep Lall Auburn University, USA

Chair, Short Courses


Michael Ellsworth IBM, USA

Co-Chair, Short Courses


Milena Vujosevic Intel, USA

Chair, Keynote Speakers


Dereje Agonafer University of Texas at Arlington, USA

Chair, Administration

Kelly Sutton University of Arizona, USA


Executive Committee


Dereje Agonafer University of Texas at Arlington, USA

Cristina H. Amon Carnegie Mellon University, USA

Avram Bar-Cohen University of Maryland, USA

Sushil H. Bhavnani Auburn University, USA

Gary B. Kromann Motorola, USA
Alfonso Ortega National Science Foundation, USA

Koneru Ramakrishna Freescale Semiconductor, USA

Baghat Sammakia

State University of New York, Binghamton, USA


International Liaisons

Europe

Bernard Courtois TIMA, France

Clemens Lasance Philips Research Laboratory, The Netherlands

David Whalley Loughborough University, UK

Orla Slattery NMRC, Ireland

Rainer Dudek Fraunhofer IZM, Germany


Africa

Mohamed-Nabil Sabry Universite Franciase d'Egypte, Egypt


Middle East

Mohamed Antar King Fahd University, Saudi Arabia


India/South Asia

T. Sundararajan Indian Institute of Technology, India

Pradeep Dutta Indian Institute of Science, India


Japan

Masaru Ishizuka Toyama Prefectural University, Japan


Korea

Sung Jin Kim

Korean Advanced Institute Science and Technology, Korea

Singapore/Far East


Andrew Tay National University of Singapore, Singapore


Taiwan

Kuoning Chiang National Tsing Hua University, Taiwan


South America

Carlos Altemani State University of Campinas, Brazil


China

Ricky S. W. Lee KHUST, Hong Kong, China

Xinyu Dou Tsinghua University, China

W. Q. Tao Xi’an Jiatong University, China




Achievement Award


We are pleased to recognize Dr. Bahgat Sammakia as the recipient of the ITherm Achievement Award for this year’s conference. The ITherm Achievement Award was instituted in 1996 and is presented biennially in recognition of significant fundamental and applied contributions to the field of electronics packaging and systems in the areas of thermal management and thermomechanical aspects.


Previous recipients are Mr. Richard C. Chu in 1996, Prof. Avram Bar-Cohen in 1998, Dr. Wataru Nakayama in 2000, Prof. Arthur E. Bergles in 2002, Prof. Michael Yovanovich in 2004, Dr. Robert J. Moffat in 2006 and Dr. Roger R. Schmidt in 2008


ITherm Past General Chairs


1988 Avram Bar-Cohen

1990 Avram Bar-Cohen

1992 Sevgin Oktay

1994 Alfonso Ortega

1996 Dereje Agonafer

1998 Sushil H. Bhavnani

2000 Gary Kromann

2002 Cristina H. Amon

2004 Koneru Ramakrishna

2006 ……………………..……………Bahgat Sammakia

2008……………………………………………Tom Lee






Reviewers’ List


Aaron Wemhoff - Villanova University
Abhijit Dasgupta – University of Maryland

Abhjit Kaisare - Iota technologies
Adam Pautsch - GE Global Research Center

Ahmed Zaghlol - Ferraz Shawmut Inc

Ahmet Sahin – King Fahd Univ of Petroleum & Minerals

Alex Corwin - GE
Amip Shah - Hewlett Packard
Amir Jokar - ThermoFluids Tech

Amy Fleischer - Villanova University
Amy Xia - Intel
Anand Desai - GE
Anandaroop Bhattacharya - Intel Technology India
Andrew Tay - National University of Singapore
Andy Delano -Honeywell
Aniruddha Pal – Applied Materials
Ankur Jain - Molecular Imprints Inc
Antar Mohamed - King Fahd U of Petroleum & Minerals

Arun Gowda - GE Global Research
Arun Raghupathy - Electronics Cooling Solutions
Ashish Gupta - Intel Corporation
Ashutosh Joshi - GE Healthcarem
Attia Khalifah - King Fahd U of Petroleum & Minerals
Attila Aranyosi - Electronic Cooling Solutions:
Bahgat Sammakia - State Univ of New York at Binghamton
Baris Dogruoz - Fluent Inc
Bill Gerstler - General Electric Global Research
Bill Maltz - Electronic Cooling Solutions
Bo Li - GE
Bob Thomas - Cisco
Brian D. Iverson - Sandia National Laboratories
Bruce Murray - SUNY Binghamton
Bruno Michel - IBM Research
C. B. Sobhan – National Institute of Technology Calicut
C.L. Chen – Teledyne

Carlos Hidrovo – University of Texas
Cesare Capriz – Aavid Thermalloy

Chan Ching - McMaster University
Changrui Cheng - Caterpillar
Charles Ingalz -
Charles Ortloff –

Charlie Zhai - NVIDIA Corporation
Chia-pin Chiu - Intel Corp
Chris Dames - UC Riverside
Chris Healey - American Power Conversion Corp
Christian S. Pedersen -
Chuan Hu - Intel
Claire Harris – Auburn University
Cliff Weasner - Ferraz Shawmut
Craig Dubrule - Cicso
Cullen Bash - Hewlett-Packard Laboratories
Darina Murray – Trinity College Dublin
David Copeland - Sun Microsystems
David Saums - DS&A LLC
Deepak Goyal - Intel Corp.
Domhnaill Hernon - Bell Laboratories, Alcatel-Lucent
Don Kearns - Sun Microsystems
Dong Liu - University of Houston
Edward McAssey - Villanova University
Ehsan Faghani - Simon Fraser University
Emad Samadiani – Georgia Institute of Technology
Erdogan Madenci - The University of Arizona
Eric Browne – Rensselaer Polytechnic Institute
Eric Forrest - Massachusetts Institute of Technology
Esmail Mokheimer - King Fahd U of Petroleum & Minerals
Ethan Cruz - IBM
Evelyn Wang - Massachusetts Institute of Technology
Gamal Refai-Ahmed - Advanced Micro Devices
Ganesh Subbarayan – Purdue University
Gary Solbrekken - University of Missouri
Gavin Stanley - Intel
Gehong Zeng – University of California Santa Barbara
George Chan - GE
Gokul V Shankaran – Ansys

Greg Walker - Vanderbilt University
Hao Wang – Peking University
Hee Joon Lee - Rensselaer Polytechnic Institute
Helge Klockow – GE Research
Hemanth K. Dhavaleswarapu – Purdue University
Hongbin Ma - University of Missouri - Columbia
Hung-Chun Yang – National Cheng Kung University
Huseyin Kizil - Istanbul Technical University
Ihtesham Chowdhury - Intel
Indranath Dutta - Washington State University
Ioan Sauciuc - Intel
James Petroski - GrafTech International
James VanGilder - American Power Conversion
Jay Nigen -
Jayathi Murthy – Purdue University
Jeffrey Suhling - Auburn University

Jennifer Jackson - GE
Jens Weyant - Advanced Cooling Technologies
Jeremy Rice - Google Inc.
Jie-Hua Zhao - Texas Instruments
Jin Yang - Intel
John Bean - APC-MGE
John Duda – Virginia Tech
John H. L. PANG - Nanyang Technological University
Joseph Dix – Airproducts

Joseph Lacey – GE
Josh Heppner – Intel

Judith Segura - Spraycool
Justin Weibel - Purdue University
Kamal Karimanal - Fluent
Karl Geisler - General Dynamics Advanced Info Systems
Karuna Kar Nanda -
Kaustubh Nagarkar - GE
Kazuaki Yazawa - University of California Santa Cruz
Koneru Ramakrishna - Anveshak
Kripa Varanasi - MIT
Krishna Kota - Georgia Institute of Technology
Kuo-Ning Chiang - National Tsing Hua University

Kyoung Joon Kim - Alcatel-Lucent (Bell Labs Ireland

Levi Campbell - IBM
Liang Gong - Georgia Institute of Technology
Liang Hsing-Sheng - Cisco
Mahmoud Ibrahim - Binghamton University
Manish Saini - Intel Corp.

Manoj Nagulapally - Fluent Inc
Marc Hodes - Tufts University
Mark Germagian - Opengate Data Systems
Mark North - Thermacore, Inc.

Mark Steinke - IBM
Marlin Vogel – eCooling

Masazumi Amagai - Texas Instruments
Maxat Touzelbaev – Advanced Micro Devices

Mehdi Asheghi - Stanford University
Mehmet Arik - GE Global Research Center
Michael Berktold - Intel
Mike Kazmierczak -
Mike Myers - Vanderbilt University
Moh'd Ababneh -
Mulugeta Berhe - Intel Corporation
Nathan Schneck – North Dakota State University

Nguyen Luu - National Semiconductor Corp
Nick Jeffers – University of Limerick
Nick Roberts - Vanderbilt University
Nidhi Paliwal – North Dakota State University
Orest Symko - University of Utah
Osamu Suzuki - Hitachi
Palinechamy Gandhidasan - KFUPM
Parisa Foroughi - Intel
Patrick McCluskey - University of Maryland
Peng Wang - University of Maryland at College Park
Peter DeBock - GE Global Research
Peter Rodgers -
Phil Tuma - 3M

Poh-Seng Lee - National University of Singapore
Pongpinit Towashiraporn - Motorola
Pradeep Lall - Auburn University
Pramod Chamarthy - General Electric
Pramod Kumar - Georgia Institute of Technology

Praveen Kumar - Washington State University
Qiang Yu - Yokohama National University
Rainer Dudek - FhG-ENAS
Raj Bahadur - Intel Corporation
Rajen Sidhu - Intel Corporation
Ram Ranjan - Purdue University
Ravi Mahajan -Intel
Ri Li - GE Global Research
Ridvan Sahan - Intel Corp.
Ron Zhang – Sun Microsystems
Sai Ankireddi - Sun Microsystems
Saket Karajgikar - University of Texas at Arlington
Salem Al-Dini - King Fahd U of Petroleum & Minerals
Sam Heffington - Nuventix
Samer Ahmed - King Fahd U of Petroleum & Minerals
Samuel Graham - Georgia Institute of Technology
Sandeep Ahuja - Intel Corporation
Sandeep Tonapi - Anveshak Tech and Knowledge Solutions
Satish Kumar - Georgia Institute of Technology
Saurabh Shrivastava - Panduitm
Sergey Semenov - Thermacore
Seung-Hyun Chae - The University of Texas at Austin
Shah Ketan - Intel Corp.

Shahin Amiri - McGill University
Shakti Chauhan - GE
Shankar Krishan –
Shawn Litster – Carnegie Mellon University
Shidong Li - Maverick Applied Science
Shlomo Novotny - Vette Corp
Shoushan Fan -n
Siddharth Bhopte - State Univ of New York, Binghamton

Sidharth Paranjape – Purdue University
Siva Gurrum – Texas Instruments
Stan Weaver - GE
Stanley Pecavar – Sun Microsystems
Stephen Solovitz - Washington State University Vancouver
Steven O'Halloran -
Sukhvinder Kang - Aavid Thermalloy
Susan Smith - Intel Corporation
Syed Zubair - King Fahd University of Petroleum & Minerals
Tadej Semenic – 1-Act
Tadhg O'Donovan - Heriot-Watt University
Tahir Cader – Hewlett Packard
Takashi Kawakami - Toyama Prefectural University
Thomas Brunschwiler - IBM
Tolga Acikalin - Intel
Tomoyuki Hatakeyama - Toyama Prefectural University
Tz-Cheng Chiu – National Cheng kung University
Unni Vaddakan - Intel Corporation
Vadim Gektin - Oracle
Vaibhav Bahadur - Harvard University

Vanessa Egan - Stokes Institute, University of Limerick
Varaprasad (Vara) Calmidi - Endicott Interconnect Technologies
Veerendra Mulay - The University of Texas at Arlington

Vibhash Jha - CALCE, UMD
Victor Chiriac - Freescale Semiconductor
Vijay Sarihan - Freescale Semiconductors
Vikas Gupta - Texas Instruments
Vincent Manno - Tufts University
Vinod Kamath - IBM
Weilin Qu - University of Hawaii at Manoa
Xuanhang Zhang - APC-MGE
Yaomin Lin – Univeristy of California, Irvine
Yeong-Yan Perng – Fluent TEchnologies
Yi-Shao Lai - Advanced Semiconductor Engineering
Ying Sun – Drexel University
Ying-Feng Pang - Intel
Yitshak Zohar – University of Arizona
Yoav Peles – Rensselaer Polytechnic Institute
Yogen Utturkar - GE Global Research

Yongho Ju - UCLA
Yoon Jo Kim - Georgia Institute of Technology
Yuri Muzychka - Memorial University of Newfoundland

Zaher Aboumourad -
Zane Johnson - North Dakota State University
Zhikui Wang - Hewlett-Packard Company 










Exhibitors (in Paris Exhibit Hall; please stop by)



3D Packaging Research Center

Advanced Cooling Technologies

AGC

AI Technology, Inc.

Alchimer

ALLVIA, Inc.

American Furukawa

Amkor Technology

ANSYS

AOS Thermal Compounds

Bergquist Company, The

CEA - LETI – MINATEC

Chip Scale Review

Cinch Connectors, Inc.

CPS Technologies Corp

DELO Industrial Adhesives LLC

Disco Hi-Tec America

Dow Corning

Dow Electronic Materials

DuPont Wafer Level Packaging

Electronics Cooling

Endicott Interconnect Technologies, Inc

ESW GmbH

E-tec Interconnect Ltd

Finetech

Fraunhoffer IZM

Fujipoly America Corp

Henkel Corp.

Heraeus, Inc.

IMEC

Innovative Research

Interconnect Systems, Inc.

JSR Micro, Inc.

Malico Inc.

Mini-Systems, Inc

Momentive Performance Technologies

Nagase & Co. Ltd

Namics Technologies, Inc

Nordson-Dage


Pac Tech USA

Palomar Technologies Inc.

Pure Technologies

Quik-Pak

RTI International

SET - Smart Equipment Technology

Shin-Etsu MicroSi

Sierra Circuits Inc.

Sigrity, Inc.

Simulia

Sony Chemicals Corp. of America

SPP Surface Technology Systems

STATS ChipPAC

Tango Systems, Inc.

TechSearch International, Inc

Tokyo Ohka Kogyo Co., Ltd.

Toray Engineering Co., Ltd.

XYZTEC BV

Yole Development

Zymet, Inc.


ITherm 2010: Program

Wednesday, June 2, 2010



TIME

SKYVIEW V/VI

SKYVIEW I

SKYVIEW II

SKYVIEW III

SKYVIEW IV

7:00-7:30

Speakers Breakfast













7:30– 9:30




SC-1: Integrated Power and Thermal Co-Design of Microprocessors Towards Achieving Optimal Performance


SC-2: Thermal Management of Three-Dimensional Integrated Circuits: Challenges and Opportunities


SC-3: Microchannel Heat Exchangers for Thermal Management of High Performance Microelectronics Systems


SC-4: Methodologies and Engineering Tools for Component Reliability



9:30–10:00





Refreshment Break

10:00-11:00

Plenary: Evolving Efficiencies in Data Center Design and Operation

Scott Noteboom (Yahoo)














11:00-12:30






TT-1: Thermal Interface Materials


TT-2: Device Level Thermal Management and LED Cooling


MT-1: Modeling and Simulation I


ET-1: Thermoelectrics/acoustics and Sensors




12:30-2:00






Lunch


2:00-3:30






TT-3: Single Phase Liquid Cooling 1


TT-4: Data Center Cooling and Phase Change Materials


MT-2: Modeling and Simulation II


ET-2: Micro-Fluidics


3:30-4:00




Refreshment Break










4:00-5:30




P1: Discussion on Energy

Harvesting


P-2: Cooling Challenges for Military Platforms


MT3: Modeling and Simulation III


P3: Cooling of 3D Packaging (NSF Sponsored Panel)


5:30-7:00

Exhibitor Reception (Joint with ECTC) in Paris Exhibit Hall












  1   2   3   4   5   6   7   8

Похожие:

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconOpening Ceremony and Committees Address by General Chair and Program Chair

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconIpo chair, nipde general Manager, us tag chair

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconI. fisheries management panel on fisheries management policies and their interaction with seafood technology Gil Sylvia (osu), Chair

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconNelson is president, board member and annual congress program co- chair of the International Management Development Association imda

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconWarren L g koontz (Professor and Program Chair)

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconCompiled and edited by Tony Shaw, Program Chair, Wilshire Conferences, Inc

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconA. James Clark Endowned Chair Professor of Project Management

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconThis report compiled and edited by Tony Shaw, Program Chair, Wilshire Conferences

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconGeorgia Institute of Technology, Atlanta, ga 30332-0205

General Chair Yogendra K. Joshi Georgia Institute of Technology, usa program Chair Sandeep Tonapi Anveshak Technology and Knowledge Solutions, usa chair, Thermal Management iconKhosrow-Pour, M. (Ed.). (2005). Encyclopedia of Information Science and Technology. Vol. 1 Hershey, pa, usa: Idea Group Inc

Разместите кнопку на своём сайте:
Библиотека


База данных защищена авторским правом ©lib.znate.ru 2014
обратиться к администрации
Библиотека
Главная страница