Northwestern University, Materials Science and Engineering Ph. D., July 1981




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НазваниеNorthwestern University, Materials Science and Engineering Ph. D., July 1981
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Curriculum Vitae

Todd S. Gross


EDUCATION:


Northwestern University, Materials Science and Engineering Ph.D., July 1981

Carnegie Mellon University, Metallurgy and Materials Science B.S., May 1975


PROFESSIONAL EXPERIENCE:


Chair of Mechanical Engineering, University of New Hampshire, 2004 - present


Full Professor (Associate 1991-1996, Assistant August 1988   July 1991), Department of Mechanical Engineering, University of New Hampshire, Durham, NH


Assistant Professor, Department of Metallurgical Engineering and Materials Science, University of Kentucky, August 15, 1981   June 30, 1988


Publications in Refereed Journals


"Detection of nanoscale etch and ash damage to nanoporous methyl silsesquioxane using electrostatic force microscopy", T.S. Gross, S. Yao, S. Satyanarayana, Microelectronics Engineering, vol. 58, p.401-407, (2008)


I. Tsukrov, V.M. Grychanyuk, T.S. Gross “Finite element modeling of diffusional creep with explicit consideration of enhanced vacancy diffusivity in a finite region adjacent to the grain interface”, Mechanics of Advanced Materials and Structures, v. 15, pp. 533-539, (2008)


Numerical modeling of grain boundary effects in the diffusional creep of Cu interconnect lines Grychanyuk V., Tsukrov I., Gross T.S.. International Journal of Fracture 127, L149-L154. (2004).


Detection of Plasma-induced, Nanoscale Dielectric Constant Variations in Carbon-doped CVD oxides by Electrostatic Force Microscopy, T. S. Gross, K.G. Soucy, E. Andideh, and K.A. Chamberlin, Journal of Physics D, Applied Physics, vol. 35, pp. 723-728, (2002)


SPM-generated out-of-plane deformation maps exhibiting heterogeneous nanoscale deformation resulting from thermal cycling of Cu-polyimide damascene interconnects T. S. Gross, N. Kamsah, and I. I. Tsukrov, Journal of Materials Research, vol. 16, pp. 3560-3566, (2001)


Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures, N. Kamsah, T.S. Gross, and I. I. Tsukrov, ASME Journal of Electronic Packaging, vol. 124, pp 12-21 (2002)


Two-dimensional, electrostatic finite element study of tip-substrate interactions in electric force microscopy of high density interconnect structures, T. S. Gross, C. M. Prindle, K.A. Chamberlin, N. Kamsah, and Y. Wu, Ultramicroscopy, vol. 87, pp. 147-154, (2001)


Interfacial Sliding in Cu/Ta/polyimide High Density Interconnects as a Result of Thermal Cycling, D.V. Zhmurkin, T.S. Gross, and L.P. Buchwalter, Journal of Electronic Materials, vol. 26, pp. 791-797, (1997)


Thermomechanical Deformation of 1 m Thick Cu-Polyimide Line Arrays Studied by Scanning Probe Microscopy" D.V. Zhmurkin, T.S. Gross, L.P. Buchwalter and F.B. Kaufman, Journal of Electronic Materials, vol. 24, pp. 976-982, (1996)


"Evidence of Fracture Surface Interference for Cracks Loaded in Shear Detected by Phase Shifted Speckle Interferometry" R.U. Goulet, T.S. Gross, and D.A. Mendelsohn, Metallurgical and Materials Transactions, vol. 27A, pp. 3853-3860, (1996)


"Shear Interaction Model for Rough Cracks based on Experimentally Characterized Fracture Surfaces" D.A. Mendelsohn, T.S. Gross, and Y. Zhang, Acta Metallurgica and Materialia, vol. 43 p. 894-900, (1995)


"Fracture Surface Interference in Shear Part II: Experimental Measurements of Crack Tip Displacement Field under Mode II Loading in 7075-T6 Al", T.S. Gross, Y. Zhang, and D.W. Watt, Acta Metallurgica and Materialia, vol. 43, p. 901-906 (1995)


"Deformation of Plated Holes: The First Soldering Thermal Cycle", T.S. Gross, D.W. Watt, and J.A Perault, Journal of Electronic Packaging, vol. 116, p. 1-5, (1994)


"Estimation of Plated Hole Barrel Stress from Thermally Induced Out-of-plane Displacement Gradients Measured by Electro-optic Holographic Interferometry", T.S. Gross, D.W. Watt, and J.A. Perault, Experimental Mechanics, vol. 32, p. 316-322, (1992)


"Thermal Strain Response of Plated Holes", T.S. Gross, D.W. Watt, R.S. Raber, J.A. Perault, and Y.Zhang, Circuit World, vol. 18, p. 21-25 (1992)


"Three Illumination Beam, Phase-shifted Holographic Interferometry Study of Thermally Induced Displacements on a Printed Wiring Board", Applied Optics, vol. 30, p. 1617-1623, (1991)


"Crack Formation during Laser Cutting of Silicon", T.S. Gross, S.D. Hening, and D.W. Watt, Journal of Applied Physics, vol. 69, p. 983-989, (1991)


"Mode I Stress Intensity Factors Induced by Fracture Surface Roughness Under Pure Mode III Loading - Application to the Effect of Loading Modes on Stress Corrosion Crack Growth", T.S. Gross and D.A. Mendelsohn, Metallurgical Transactions, vol. 20A, p. 1989-2000 .(1989)


"Evidence for Dynamic Strain Aging by Oxygen in Cochralski-Grown Silicon Single Crystals from 1173 K to 1573 K", T.S. Gross, V.K. Mathews, R.J. DeAngelis, and K. Okazaki, Materials Science and Engineering, vol. A117, p. 75-82. (1989)


"On the Effect of Crack Face Contact and Friction Due to Fracture Surface Roughness in Edge Cracks Subjected to External Shear", T.S. Gross and D.A. Mendelsohn, Engineering Fracture Mechanics, vol. 31, p 405-420, (1988).


"Analysis of Frictional Effects on Cylindrical Model III Fatigue Crack Propagation Specimens", T.S. Gross and D. Mendelsohn, Fatigue and Fracture of Engineering Materials and Structures, vol. 11, p. 167-178, (1988).


"Environmental Effects on Fatigue Crack Initiation in 2.25 Cr - 1 Mo Steel and 316L Stainless Steel", V.K. Mathews and T.S. Gross, Journal of Engineering Materials and Technology (Trans ASME), vol. 20, p. 240-246, (1988).


"High Temperature (900 - 1300oC) Mechanical Behavior of Dendritic Web Grown Silicon Ribbons: Strain Rate and Temperature dependence of the Yield Stress", V.K. Mathews and T.S. Gross, Scripta Metallurgica, vol. 21, p. 117-122, (1987).


"Frictional Effects on Fatigue Crack Growth in Beta-Annealed Ti-6A1-4V", T.S. Gross, S. Bose, and Li Zhong, Fatigue and Fracture of Engineering Materials and Structures. vol. 11, p. 179-187, (1988).

"Tensile Properties of Czochralski-Grown Silicon from 900 - 1200C", V.K. Mathews and T.S. Gross, Scripta Metallurgica, vol. 20, p. 1677-1682, (1986).


"Effect of Humid Air on Crack Tip Cyclic Plastic Work in Low Carbon Steel", T.S. Gross and A.D. Joseph, Fatigue and Fracture of Engineering Materials and Structures, vol. 9, p. 49-56, (1986).


"Effect of Load Ratio on Crack Tip Plastic Work - Evidence for Frictional Work", T.S. Gross and L. Zhong, Scripta Metallurgica, vol. 20, p. 1713-1716, (1986).


"Frictional Effects on Mode III Fatigue Crack Propagation", T.S. Gross, Scripta Metallurgica, vol. 19, p. 1185, (1985).


"Effect of Coal Liquefaction Solvents on Fatigue Crack Initiation in 2.25Cr-1Mo Steel and 316L Stainless Steel", T.S. Gross, V.K. Mathews and P.N. Kanga, Journal of Engineering Materials & Technology (Trans. ASME), vol. 17, p. 325-328 (1985).


"Comparison of Calorimetric Plastic Work Measurement with Strain-Gage and Subgrain Techniques in 1008 Steel", A.D. Joseph and T.S. Gross, Engineering Fracture Mechanics, vol. 21, p. 63-74 (1985).


"Calorimetric Measurement of the Plastic Work of Fatigue Crack Propagation in 4140 Steel", T.S. Gross and J. Weertman, Metallurgical Transactions, vol. 13A, p. 2165-2173, (1982).


PROCEEDINGS AND BOOK ARTICLES:


Tsukrov, B. DRACH, T.S. Gross “Influence of Anisotropy of Pyrolytic Carbon on Effective Properties of Carbon/Carbon Composites”, Proceedings of the Seventeenth International Conference on Composite Materials - ICCM17, Edinburgh, UK, 2009


"Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region", I. Tsukrov, V. Grychanyuk, T. Gross, (2006). Paper in peer-reviewed conference proceedings, Editor(s): C.A. Brebbia Proceedings of the 3rd International Conference on High Performance Structures and Materials: WIT Press, pp. 685-694


“Nanoscale observation of dielectric damage to low k MSQ interconnects from reactive ion etching and ash treatment”, T.S Gross, S. Yao, S. Satyanarayana Materials Research Society Symposium Proceedings, v 863, Materials, Technology and Reliability of Advanced Interconnects - 2005 Symposium, 2005, p 165-169


"A Nanoscratch Method for Assessing Wear of Metal Carbide-Metal Nacreous Nanostructures, R.W. Obbard and T. S. Gross, MRS Proceedings on Advances in Surface Engineering -- Fundamentals and Applications, Fall 2001 p 359-364 (2002)


“Observation of heterogeneous, nanoscale deformation on damascene interconnects with a polymeric dielectric” T. S. Gross, N. Kamsah, and I.I. Tsukrov, Proc IITC, (IEEE Electron Devices Soc.) p. 198-200, (2001)


“Use of electric force microscopy to detect process-induced, nanoscale dielectric damage of low k oxides” T.S. Gross, K.G. Soucy, E. Andideh, Proc IITC, (IEEE Electron Devices Soc.) p. 241-243 (2001)


“Interfacial Sliding in Cu/Ta/polyimide High Density Interconnects as a Result of Thermal Cycling”, D.V. Zhmurkin, T.S. Gross, and L.P. Buchwalter, in Creep and Stress Relaxation in Miniature Components, Ed. H. Merchant, TMS-AIME pp. 255-270, (1997)


“Progress toward Understanding the Effect of Fracture Surface Interference on Shear Modes of Crack Growth”, T.S. Gross, D.A Mendelsohn, and E.K. Tschegg, to appear in Proceedings of Fifth International Conference on Biaxial/Multiaxial Fatigure and Fracture (invited paper) (1997)


T.S. Gross and S. Lampman, “Monotonic and Cyclic Mechanisms of Crack Growth”, Fatigue and Fracture, ASM Metals Handbook, Tenth Edition, Volume 19, pp. 42-60. (1996)


“Effect of Elastic Modulus and Yield Strength on Fracture Surface Interference in Remotely Loaded Mode II Cracks”, T. S. Gross, R.U. Goulet, and D.A. Mendelsohn, in The Johannes Weertman Symposium, Eds. R.J. Arsenault, D. Cole, T. Gross, G. Kostorz, P.K. Liaw, S. Parmeswaran, and H. Sizek, TMS Proceedings February 1996 Meeting Anaheim, CA, pp. 255-260, (1996)


"In-situ measurements of three dimensional displacement fields in shear crack growth using phase shifted speckle interferometry" D.W. Watt, R. U. Goulet, and T.S. Gross, Proceedings of SPIE Symposium on Optical Science Engineering and Instrumentation, vol. 2545, p. ?, San Diego, CA (1995)


"Thermally Induced Displacement Field Around Plated Holes on a Constrained Coefficient of Expansion Printed Wiring Board Using Holographic Interferometry", T.S. Gross, D.W. Watt, and S.D. Hening, Proceedings of International Electronic Packaging Society, September 1990.


"Constitutive Law for Calculating Plastic Deformations During CZ Silicon Crystal Growth", C.T. Tsai, V.K. Mathews, T.S. Gross, O.W. Dillon Jr., and R.J. DeAngelis,

Proceedings of 19th Canadian Fracture Conference, National Research Council, (1989).


"Effects of Strain Rate on Flow Properties", P.P. Gillis and T.S. Gross, Metals Handbook, 9th Edition, Volume 8 Mechanical Testing, ASM, Metals Park, OH, p. 38-46, (1985).


"Crack Tip Cyclic Plastic Work in Beta-Annealed Ti-6A1-4V", T.S. Gross, A.D. Joseph and S. Bose, Fracture: Measurement of Localized Deformation by Novel Techniques, Ed. W.W. Gerberich, and D.L. Davidson, TMS-AIME, Warrendale, PA, p. 191-200, (1985).


Funded Research


Elimination of microcracks in 3D Woven Composites, NHIRC, $102,500, 6/1/2009 – 5/31/2010 (co-PI with Igor Tsukrov)


Low cost, high bandwidth, non-intrusive machining force sensors for integration into smart machining systems, NSF Civil, Mechanical, and Manufacturing Innovation, $528,000 6/1/2009 – 5/30/2012, (with Kent Chamberlin EE-UNH)


Field Assisted Nanopatterning, Sub award from NSF Center for High Rate Nanomanufacturing , $130,000, 9/1/2008 –8/31/2010


Materials World Network: Multi-Scale Study of Chemical Vapor Infiltrated Carbon/Carbon Composites, NSF Division of Materials Research, $388,935, 1/1/2008 – 8/31/2011 (co-PI with Igor Tsukrov and PI’s from University of Karlsruhe)


“MRI: Acquisition of a Digital Imaging Correlation System to Advance Research, Training and Education in Engineering”, NSF-CMMI, Co-PI, with B.Kinsey - PI, E.Bell (UNH), $103,099, 09/01/08-08/31/2011.


GOALI: Interconnect Processing Enhancement by Measurement of Nanoscale Dielectric Constant Degradation and Development of Experimentally Verified Models of Nanoscale Deformation, NSF- DMII 7/03-7/07, $400,000 (PI with co-PI Igor Tsukrov)


“Pulsed Laser Deposition of Nanostructured Carbide Coatings for Improved Performance in Rolling Contact Applications”, AFOSR, $2,730,000, 8/1/98-7/31/02 (co-PI with PI James E. Krzanowski, Carmela Amato-Wierda, Olof Echt)


“Electric Field Measurement by Scanning Probe Microscopy to Detect the Effect of Nanoscale Material Inhomogeneity on Signal Propagation in High Density Interconnects”, Semiconductor Research Corporation, $245,000, 4/1/98-3/31/01 (with Kent Chamberlin EE-UNH)


“Measurement and Modeling of Heterogeneous, Nanoscale Deformation on Cu-polyimide High Density Interconnects using Scanning Probe Microscopy”, Principal Investigator, NSF-ECS, $245,000, 9/1/97-8/31/2000 (with Igor Tsukrov, ME-UNH)


“Cu Vapor Laser Cutting” NH Industrial Research Commission and Resonetics Inc. $67,000, 11/1/98-10/31/99


“Evaluation of Cu Vapor Laser Cutting of Si” ASE Americas, $139,000, 9/1/98 – 8/31/99 (PI with co-PI David W. Watt)


“Implementation of a Materials Synthesis and Characterization Laboratory Component Across the Undergraduate Science and Engineering Curriculum” NSF-ILI,

Co-PI with PI Carmela Amato-Wierda, UNH Chemistry, $200,000, 9/1/97 - 8/31/99


“Electric Field Measurement by Scanning Probe Microscopy to Detect the Effect of Nanoscale Material Inhomogeneity on Signal Propagation in High Density Interconnects” Semiconductor Research Corporation, $93,000, 10/1/97-9/30/98 (with Kent Chamberlin EE-UNH)


"Flexible Bright: Product Process Improvement" Principal Investigator, NHIRC/Textron Automotive Technology Center, $50,000, 1/95-12/97


"Flexible Bright: Technical Support" Principal Investigator, NHIRC/Davidson Technology Center, $110,000, 9/92-9/94


"Hot Gas Filters" co-Principal Investigator (with V.K. Mathur, Chemical Engineering, UNH), NHIRC/Techniweave, $141,500, 3/93-present


"An Interdisciplinary Approach to the Synthesis, Measurement, and Optimization of Polyimide Properties for Multi-chip Module Substrates" Principal Investigator subcontract on NSF project at University of Massachusetts, $450,000 ($217,500 - UNH subcontract) 9/92 - 4/96


"An Experimental and Analytical Investigation of the Effect of Fracture Surface Interference in Shear", Principal Investigator with subcontract to D.A. Mendelsohn, Ohio State University, Department of Energy - Basic Energy Sciences, $255,000,

9/94 - 8/97


"Holo-Interferometric Studies of Plated Hole Deformation", Principal Investigator (with Professor D.W. Watt, University of New Hampshire), Digital Equipment Corporation, $57,000, 1990-91


"Effect of Fracture Surface Interference on Shear Crack Growth", Principal Investigator (with Professor D.W. Watt, University of New Hampshire, and Professor D.A. Mendelsohn, Ohio State University), Department of Energy - Basic Energy Sciences, $307,000, (1990-1993).


"Measurement of Spatial Variation of Thermal Expansion on a Constrained Coefficient of Expansion Circuit Board, IBM Owego, $7000, (1990).


"Measurement of Thermally Induced Strains at Plated Through Holes in Constrained Coefficient of Expansion Circuit Boards", Principal Investigator (with Professor D.W. Watt, University of New Hampshire), Sanders Associates, $21,000, (1990).


"Measurement of Thermally Induced Strains at Plated Through Holes in Constrained Coefficient of Expansion Circuit Boards", Co-Principal Investigator (with Professor D.W. Watt, University of New Hampshire), Sanders Associates, $31,200, (1989).


"Measurement of Laser Cutting Damage in Silicon Wafers Using Holographic Interferometry", Co-Principal Investigator (with Professor D.W. Watt, University of New Hampshire), Mobil Solar Energy Corporation, $15,800, (1989).


"Stress-Strain Studies in Silicon Ribbon", Co-Principal Investigator (with Professor O.W. Dillon, Engineering Mechanics and Professor R.J. DeAngelis, Metallurgical Engineering and Materials Science, University of Kentucky) DOE/JPL, $250,000, (1984-1986).


"Stress strain Studies in Silicon Ribbon", Co-Principal Investigator (with Professor O.W. Dillon, Engineering Mechanics and Professor R.J. DeAngelis, Metallurgical Engineering and Materials Science, University of Kentucky), SERI/DOE, $99,000, (1986-1987).


"Plastic Work of Fatigue Crack Growth for Ductile & Brittle Growth Mechanisms", Principal Investigator, NSF, $48,000, (1982-1985).


"Mechanisms of Fatigue Under Coal Liquefaction Conditions", Principal Investigator, (with Professor H. Conrad, North Carolina State University), $199,000, DOE, (1983-1985).


"Donation of MTS Servohydraulic Testing Machine", Continental Group, Approximate Value - $50,000, (1984).


"Load Ratio Effects on Crack Tip Cyclic Plasticity", University of Kentucky Research Foundation, $550, (1985).


"Purchase of Biaxial Servohydraulic Testing Machine", W.Y. Lu and T.S. Gross, Major Equipment Grant, University of Kentucky Research Foundation, $68,800, (1981).


"Equipment Request for Calorimetric Measurement of the Work of Fatigue Crack Growth", University of Kentucky Research Foundation Major Equipment Grant, $17,991, (1981).

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